广州LNP THERMOCOMP Lexan_SML5897
应用范围： 产品描述 LNP THERMOCOMP Lexan_SML5897物性表 LNP* Thermocomp* Lexan_SML5897 compound is a 40% carbon fiber reinforced PC for use in high modulus applications.
下载PDF
详细介绍
产品描述
广州LNP THERMOCOMP Lexan_SML5897物性表
LNP* Thermocomp* Lexan_SML5897 compound is a 40% carbon fiber reinforced PC for use in high modulus applications.
来源：http://gz.va-so.com/product827950.html
发布时间：2022/5/9 12:04:39
